Too soon for iPhone 16 series rumors?

According to a report from 9to5Mac, based on information provided by insiders in Apple’s supply chain, the iPhone 16 Pro is expected to receive further upgrades in terms of features. The device is anticipated to come with advanced 5G Advanced (also known as 5.5G) network service, the latest Wi-Fi 7 technology, and improved ultra-wide-angle lenses.

Reportedly, the iPhone 16 Pro will be equipped with Qualcomm’s Snapdragon X75 modem, capable of delivering impressive 7.5 Gbps download speeds on 5G networks. Additionally, while the iPhone 15 Pro was among the first to introduce Wi-Fi 6e, rumors suggest that its successor, the iPhone 16 Pro, will feature Wi-Fi 7, offering speeds of up to 46 Gbps.

Furthermore, the standard iPhone 16 model is expected to continue with dual rear cameras, while the iPhone 16 Pro will upgrade to a quad-camera setup. Although currently only the iPhone 15 Pro Max boasts a quadruple-reflection and periscope lens with 5x optical zoom, next year’s iPhone 16 Pro and iPhone 16 Pro Max are said to support this feature.

The report also mentions that camera improvements go beyond that. The iPhone 16 Pro will feature a 48-megapixel sensor for its ultra-wide-angle lens, a significant leap from the current 12-megapixel sensor.

According to the report, the iPhone 16 Pro Max will become the largest iPhone ever released by Apple, with a screen size of 6.9 inches, while the iPhone 16 and 16 Plus are expected to have similar dimensions to the 15 and 15 Plus models. The estimated weight for the iPhone 16 is 173 grams, with a screen size of 6.1 inches, while the iPhone 16 Plus weighs 203 grams, with a screen size of 6.7 inches.

Additionally, the report mentions that the iPhone 16 series is expected to be powered by the A18 chip (N3E), while the iPhone 16 Pro and iPhone 16 Pro Max will feature the A18 Pro chip. This reflects an advancement from the previous generation A17 Pro’s 3-nanometer process. Although they are expected to retain 8 GB of RAM, these devices should see improvements in connectivity. The N3E process represents TSMC’s second-generation 3-nanometer chip technology, offering lower manufacturing costs and higher yields compared to the first-generation N3B process.